Revealing Hidden Damage from Probe Indentations on Electronic Components and How to Mitigate It

By Dr. Eyal Weiss, Founder & CTO , Cybord

As electronic component manufacturers strive for quality and reliability, one often overlooked concern is the impact of probe testing on component terminations. This article discusses this critical issue and explores how to mitigate its effects.

During manufacturing, electrical probes are attached to components for testing and programming. These probes establish electrical contact with the terminations. As the number of terminations grows (think densely packed components), the force applied during probing increases. The goal is to create a reliable electrical connection, but this force can inadvertently cause damage and introduce foreign material that may introduce contamination.

The Hidden Threat of Probe Marks

Those seemingly innocuous indentations left by the probes may appear harmless. However, beneath the surface lies a potential threat to component reliability. In some cases, the stress from probing cracks, peels, or damages the top layer of the termination, compromising the component’s long-term performance. The probe marks are negatively affecting the local wettability. Additionally, probes may introduce contaminants to the termination. Over time, these contaminants can lead to corrosion or even mold infestation.

IPC Standards: Balancing Safety and Reliability

Industry standards provide guidance on this delicate balance:

• IPC-A-610: Probe indentation itself isn’t considered a defect unless it causes issues. For example, if the indentation leads to corrosion, cracks, mold, shorts, opens, peeling, or deformation, it becomes a defect.
• IPC-7093 (BTC): For bottom termination components (BTCs), severe probe indentations on the underside are defined as defects. However, this issue often goes unnoticed because the marks are hidden from view.

Cybord’s Innovative Solution: Visual Assurance

Cybord has developed a novel approach to address this hidden risk. By leveraging images taken by pick-and-place machines from the bottom side of components during placement, our ai algorithm visually inspects all terminations. The algorithm is based on big data with over 4 billion components under its belt. The algorithm identifies safe probe marks and flags potential defects. If the probe mark has led to corrosion, mold, deformation, peeling, or other issues, we catch it. Importantly, our method aligns with both IPC-A-610 and IPC-7093 requirements.

By proactively identifying and mitigating the defect caused by probe marks, we enhance the reliability and longevity of electronic components, ensuring they meet the highest standards of quality and performance.